Skills

This is a list of my used techniques and skills.

Transmission electron microscopy (TEM)

• Experience with FEI/TFS/Philips instruments
• BF- and (WB)DF-TEM (two-beam condition)
• SAED
• (Cs-corrected) HRTEM (minimum contrast, Scherzer defocus, NCSI)
• (Cs-corrected) HRSTEM (HAADF, ADF, ABF, BF)
• µP-STEM and nanobeam diffraction (NBED)
• STEM-EDS
• STEM-EELS (mostly core-loss)

Used instruments:
FEI Titan³ 80-300 (image-corrected and double-corrected), FEI Tecnai Osiris, Philips CM200 FEG SuperTwin, FEI Tecnai G2, Zeiss 912 (barely, but with image plates :-)).

Scanning electron microscopy (SEM)

• Experience with FEI/TFS instruments
• Basic and high-resolution SE and BSE imaging (field-free/immersion modes)
• Conventional (> 5 keV) and low-energy (< 5 keV) SEM-EDS
• SEM-EBSD (Bruker system)
• STEM-in-SEM (with EDS and TKD)
• Beam-deceleration SEM
• (In-situ) ESEM (low pressure and water vapor) for materials science (reduce charging, sample-water reactions, plasma generation)

Used instruments: FEI Strata 400S, FEI Quanta 650 & Quanta 250 ESEM, FEI Nova 200, TFS Helios G4 FX & Helios 650 NanoLab, Zeiss/LEO Gemini 1530 (barely)

Focused ion beam (FIB)

• Experience with FEI/TFS instruments (Ga-ion source)
• Ion imaging (channeling)
• Cross-section preparation & SEM imaging
• FIB-SEM tomography
• TEM-sample preparation (cross-section & plan-view geometries)

Used instruments: FEI Strata 400S, TFS Helios G4 FX & Helios 650 NanoLab, FEI Nova 200

Other Techniques

• Basic experience in clean-room environment (spin coater, mask writer, mask aligner, PVD metal deposition, RIE, wet etching, plasma cleaning)